Alexey Kardashevsky

🚀 Big announcement! EdgeCortix’s MERA compiler & software framework now powers Renesas’s new RUHMI framework, enabling efficient AI deployment across MCUs & MPUs - including the recently launched RA8 MCUs. 🤖🔧 👀 Press Release: https://hubs.li/Q03xqk7Y0 🎓 Learn about RUHMI → https://hubs.li/Q03xqkdx0

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At the embedded world Exhibition&Conference 2026, Otto Aureliano Rolloff from Renesas Electronics showcased a new Zephyr based demo on their RA microcontrollers. The demo featured a fan running TinyML for predictive maintenance, sending data via Bluetooth to a connected Oven demonstrator. It also highlighted high end graphics on Zephyr using LVGL demonstrating advanced HMI capabilities on the RA platform. #ZephyrRTOS #opensource

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Shrike-lite is a $4 FPGA board featuring Renesas ForgeFPGA and Raspberry Pi RP2040 MCU, perfect for VHDL, and hybrid hardware design.

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Micron has unveiled 24Gb GDDR7 memory chips rated for up to 36 Gb/s, establishing a new bandwidth tier for future GPU architectures. At 3GB per die, the higher density enables more flexible VRAM scaling across common bus widths, while the 36 Gb/s speed grade significantly increases potential memory throughput. A 512-bit interface at this rate could exceed 2.3 TB/s of total bandwidth, raising the ceiling for next-generation gaming GPUs and AI accelerators. As AI-enhanced rendering and high-resolution workloads grow, memory bandwidth and capacity are becoming central performance differentiators in the GPU market. Full analysis: https://lnkd.in/gQBPkxhW #Micron #GDDR7 #Semiconductors #GPUIndustry #AIHardware #MemoryTechnology

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Metal Fill is Now a Timing Signoff Gatekeeper Especially in GAAFET Nodes 🔥 GAAFET nodes changed everything   Timing is no longer about routing   It is about parasitics you cannot see ⚡ Why Fill Matters   🔸 GAAFET channels are ultra narrow   🔸 Electrostatics are extremely sensitive   🔸 Metal fill behaves like extra gates   🔸 Coupling and delay jump instantly 📉 No Fill vs With Fill   🔹 No Fill looks clean   🔹 With Fill exposes real GAAFET delay   🔹 Coupling rises 25 to 40 percent   🔹 Long wires slow down up to 47 percent 📡 What Actually Gets Worse   🔸 Coupling capacitance explodes   🔸 Fringe capacitance rises   🔸 Net resistance shifts   🔸 SI noise becomes unpredictable 💥 Real Risk   🔸 Tapeout on No Fill   🔸 Fab inserts real Fill   🔸 GAAFET silicon fails   🔸 Respins begin 🔐 Signoff Truth   🔸 Use Fill SPEF only   🔸 No Fill timing is fantasy   🔸 Fill timing is silicon reality 🚀 Bottom Line   GAAFET physics amplifies parasitic impact   Metal fill becomes mandatory for true timing closure   Skipping it is not optimization   It is gambling ❓ Your Move   Are you signing off on Fill SPEF   Or still trusting No Fill optimism #VLSI #PhysicalDesign #GAAFET #Timing #STA #Signoff #Semiconductors #ChipDesign #Tapeout

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Title: ASIC is set to challenge AI GPUs—TSMC secures major orders and raises prices. Summary: NVIDIA's AI GPU dominance has led to increased ASIC development, creating a competitive atmosphere. TSMC benefits from both sides, with rising prices for advanced packaging and 2nm technology. Market expectations suggest TSMC will maintain strong performance in 2025 and 2026. NVIDIA initially planned to enter the ASIC market but later shifted to a collaboration strategy. The AI industry is expanding, with major players working together to grow the market. Supply chain experts predict strong demand for AI chips, with ASIC shipments expected to grow by 50% annually. Cloud service providers and chipmakers are accelerating ASIC development to reduce reliance on NVIDIA's expensive GPUs. Companies like Google, AWS, Meta, and Microsoft are investing in self-developed chips. Broadcom, a leading ASIC manufacturer, is emerging as NVIDIA's key competitor. TSMC dominates the semiconductor industry, producing chips for both NVIDIA and ASIC manufacturers. Its advanced packaging and 2nm production capacity ensure continued growth. AI accelerator revenue is projected to grow at a 45% annual rate, with ASIC shipments increasing significantly from 2025 to 2027. https://lnkd.in/g2HSaeqC

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Morse Micro secures $88M AUD Series C funding to scale Wi-Fi HaLow chip production, drive IoT 2.0 adoption, and boost Australia’s semiconductor indust...

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