Jake Johnson, MBA

Keysight VP and GM of Wireless Test, Kalyan Sundhar, shares how developments in Open RAN, #AI, and NTN are shaping the path to #6G. He explains why Open RAN is ready to deliver and how it plays a critical role in the evolution of next-gen #networks. Explore how Keysight is helping define the future of 6G: https://gag.gl/e5QZKQ

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Great to see delegates from Taiwan visiting and learning about MILLIBEAM’s effort in Australia’s DeepTech, especially across 5G/6G, AiP dual-list applications

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Graduate level Analog Circuit Design is one of the more complex core Electrical Engineering topics. It is exciting to see the progress in this field coming so quickly on the heels of initial efforts to use AI by great circuit's teachers like Behzad Razavi (https://lnkd.in/gPNrvbnB) samvid.ai and Prasad Gudem are democratizing the teaching of this complex subjects. Their latest demonstration has ~2X better outcomes than Razavi's initial study and offers a path to creating tightly constrained, finely optimized teaching systems that in certain cases can outperform not only the teaching assistant but also the professors. The talk was really fun. Everyone involved in teaching about circuit design should sit up and take notice of the extra-ordinary progress that can come from great teachers collaborating closely with AI experts. AI is not magic, its engineering. Teaching using AI is not heresy, it is about using the best engineering tools to produce the best student outcomes. Let the great AI revolution in graduate education begin!

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What hurdles stand between us and the promise of 6G? Keysight Systems Engineer Greg Jue shares insights on the challenges ahead and how our #6G testbed is helping accelerate real-world solutions. We're working with #innovators worldwide to turn the vision of 6G into reality. Learn more about our 6G work: https://gag.gl/M87okv

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【Mobile Base Stations: Transforming Wide-Area Wi-Fi Deployment】 Wi-Fi's primary drawback—limited coverage area—is now being overcome. We maintain the high frequency utilization efficiency of small cells while solving the range problem. Our solution: the "Robot Base Station," featuring a durable Suzuki electric chassis carrying a PicoCELA Mesh Wi-Fi Access Point. These units automatically coordinate via a wireless mesh to provide extensive coverage. Remote operation enables you to freely and flexibly create Wi-Fi access on demand, precisely where required. This fundamentally shifts the paradigm of infrastructure installation. This is the future of wireless communication. https://lnkd.in/gygrFBdY

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Move over, HBM—there may be an even more powerful memory architecture on the horizon. At the Future of Memory and Storage (FMS) Conference in Santa Clara, NEO Semiconductor unveiled its new “Extreme” High Bandwidth Memory (X-HBM), which promises up to 16X more bandwidth or 10X higher density than "traditional" HBM. CEO Andy Hsu introduced the concept during his keynote yesterday, positioning X-HBM as a potential game-changer for future AI servers. More details via StorageNewsletter: https://lnkd.in/gi_S8eqd Will X-HBM become the next big leap in AI memory? Time will tell… but I’m looking forward to learning more. #Memory #AIChips #XHBM #FutureOfCompute #Semiconductors #ArtificialIntelligence

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As I often say, "There are many paths to the mountain top." Some are more difficult than others. It takes resolve, courage and action. Here's a new example of risk versus reward with a key milestone to be met. WUS Printed Circuit in Kunshan Chin plans to invest up to$300 million in a high-density optical-electrical PCB project to support next-generation packaging and interconnect needs for AI servers and other high-performance systems. The company board approved the creation of a wholly owned subsidiary to lead the project. The operation will develop Chip-on-Wafer-on-Platform (CoWoP) packaging and modified semi-additive process (mSAP) manufacturing, supported by an integrated workflow spanning R&D, pilot production, process validation, and commercial deployment as a technology incubation platform.  It plans to develop optical-copper integrated PCB architectures to improve signal transmission, power distribution, and functional integration in high-speed, high-bandwidth modules. Mass production will follow ONLY after the processes meet industrial qualification standards. Investment to be implemented in two phases. Under the first phase, WUS will invest $100 million in a leased facility for pilot production lines for CoWoP and mSAP processes, supporting early-stage development of optical-electrical integration technologies. The second phase, SUBJECT TO first-phase results and market conditions, would involve an additional $200 million investment. The company said it may cancel the second phase if performance targets are not met or if market conditions worsen. If successful, the project is expected to add 1.3 million high-density optical-electrical PCBs per year, generating about $285 million in annual revenue. CoWoP, often described as “CoWoS without a substrate,” directly bonds the silicon die and interposer onto a reinforced platform PCB, eliminating conventional package substrates and BGA processes. Source: Digitimes.

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